About Nanya

About Nanya

Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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Talent recruitment

Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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TAC-5000 fully automatic silicon wafer insertion machine

Product Introduction

The slicing mechanism of this device can evenly separate silicon wafers in any state, including those fully bonded with mortar; The technology has been applied for a utility model;

Silicon wafer strip separation principle: This component is the core technology of the device, successfully developed by South Asia and has applied for two inventions. We abandon the conventional method of directly absorbing silicon wafers and instead use water absorption (there is always a certain distance between the silicon wafers and the conveyor belt), so that the separated silicon will move towards the conveyor belt in a non-contact manner along the direction of water flow, without any damage to the silicon wafers. At the same time, this technology has laid the foundation for the use of fully automatic chip insertion machines for ultra-thin (<140mm) silicon wafers, and thick and thin silicon wafers can use the same equipment;


Performance and technical parameters
Process characteristics
Control system
Fragment detection system
Layout Plan of Insertion Machine
Main component configuration
Technical support and service requirements

1. Overall dimensions     2220L×1120W×1850H(mm)

2. Flower basket specifications     50, 25 pieces

3. Silicon wafer size     125mm、156mm

4. Wafer thickness     140~200um   

5. Suitable for silicon wafers     Monocrystalline silicon, Polycrystalline silicon

6. Production capacity     > 5000 tablets/hour

7. Fragmentation rate        <0.2%

8. Control system     PLC programmable controller, AC servo system

9. Pressure            0.4~0.5Mpa drying gas

10. Air source flow rate   Intake pipe diameter≥8mm

11.Power supply           AC220V(Single phase three wire)、50HZ

12. Power   2.5KW

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